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Component Testing

Comparison of DIC and FEA

In engineering, component testing is essential to verify that products meet design specifications, safety standards, and performance expectations. Engineers test either individual parts or entire structures depending on the required insights and testing methodology. One of the most effective ways to analyze component behavior is by combining Digital Image Correlation (DIC) with Finite Element Analysis (FEA) for precise strain and displacement evaluation.

Objective

This study aims to evaluate the strain and displacement fields on both the top and side surfaces of a clamping device component. The results obtained using DIC were compared with predictions from FEA to assess the accuracy of the two methods.

Description of the Case Study

The test was performed on a clamping device component, analyzing strain distribution and displacement under two conditions:

Half-way screwed

Fully screwed

A pair of synchronized 2.3 MP Ximea cameras, capturing images at 20 fps, was used to track surface displacement and strain with high precision. The cameras were positioned at a 20° angle to accurately capture out-of-plane motion.

The data obtained provided insights into the structural integrity of the component and allowed for a direct comparison between experimental DIC results and simulated FEA predictions.

Component testing
Fig 1: Clamping device
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Visual Results

Displacement Measurement

The displacement in the X and Y axes was measured on the top surface of the component after fully tightening the screw. The results are shown in the two images below:

DIC: Displacement in X [mm]
Displacement Y DIC
DIC: Displacement in Y [mm]
Displacement X FEA
FEA: Displacement in X [mm]
Displacement y FEA
FEA: Displacement in Y [mm]

Strain Measurement and FEA Comparison

Next, strain values were measured in E1 and E2 directions under identical conditions. The following images show the results for both:

E1

To further compare the experimental and simulated results, the strain values were recorded when the screw was halfway tightened. The comparison between DIC and FEA is as follows:

DIC: 0.592 % | FEA: 0.603 %

DIC: -0.520 % | FEA: -0.523 %

With a highest percentage difference of less than 3%, the DIC method closely matched FEA predictions, validating its accuracy in component testing.

E1 [%]: DIC
E2 [%]: DIC
E1 FEA
E1 [%]: FEA
E2 FEA
E2 [%]: FEA

Advantages of Using DIC for Component Testing

Full-field strain and displacement tracking instead of point-based data from traditional sensors.

Non-contact measurement, avoiding errors introduced by mechanical sensors.

High accuracy and flexibility, capturing strain and displacement across complex geometries.

Post-processing capabilities, allowing in-depth analysis and direct comparison with FEA simulations.

This case study demonstrates that Digital Image Correlation (DIC) provides highly accurate strain and displacement data, closely matching the results from Finite Element Analysis (FEA). With a deviation of less than 3%, DIC has proven to be a powerful tool for component testing, offering real-world validation of simulated models.

For more insights on how DIC enhances component testing, explore our DIC-based testing solutions here.

For more information about component testing and our solution AMEE 3D or AMEE 3D VEX, please Contact us through email info@mercury-dic.com.

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